INSIGHT workshop to be held at the European Microwave Week this fall
INSIGHT to hold workshop at EuMW 2017
Please visit EuMW's web pages for full details and registration.
Title of workshop: Integration of III-V Nanowire Semiconductors for Next Generation High Performance CMOS SOC Technologies and Competitive Solutions
Organisers: Lars-Erik Wernersson and Didier Belot
Objective of this workshop is to underline initiatives which aims at exploiting the transistor benefits in the millimetre wave application area. We will focus on key circuits including both LNAs and PAs. Co-integration of III-V technology with Si CMOS as well as all-III-V CMOS technology is considered. In this workshop, we will discuss the benefits of the III-V nanowire technology and compare to other available technologies. We will demonstrate very high performance on the transistor level and present the most promising approaches to exploit the transistor properties at the circuit level. The workshop will start with an overview of the state of art, and initiatives targeting III-V integration in Si technologies, followed by a presentation focusing on trends in RF and mmW applications which are demanding new developments for high performance devices. The workshop will also provide a complete overview from materials, through devices to full circuit design and circuit evaluation. Presentations from “best in class” European researchers active in the area of III-V materials, devices and circuits, will provide a European Perspective on the current state of the art in III-V devices for RF and mmW applications. At the end of the day, a round table discussion will close the workshop, in order to well define which technology can answer to which application.
08:30 - 08:55 Introduction Lars-Erik Wernersson, University of Lund, Sweden
08:55 - 09:20 Application Trends and Technology Needs Sven Mattisson, Ericsson, Sweden
09:20 - 10:10 Material for III-V Nanowires Iain Thayne, University of Glasgow, UK
10:10 - 10:50 Break 10:50 - 11:40 IIII-V Materials and Devices for RF and mm-Wave Research Nadine Collaert, IMEC, Belgium
11:40 - 12:30 Devices and Modeling for RF and mm-Wave Michael Schröter, University of Dresden, Germany
12:30 - 13:50 Break
13:50 - 14:40 Devices and Modeling Erik Lind, University of Lund, Sweden 14:40 - 15:30 III-V CMOS Co-Integration Veeresh Deshpande, IBM, Switzerland
15:30 - 16:10 Break
16:10 - 16:50 III-V and Si Circuits for RF and mm-Wave Herbert Zirath, Chalmers University, Sweden
16:50 - 17:30 III-V CMOS Circuit for RF and mm-Wave Thomas Merkle, Fraunhofer, Germany
17:30 - 17:50 Round Table Discussion and Conclusion
Moderator: Didier Belot, LETI, France
INSIGHT project 3rd Consortium Meeting
INSIGHT 3rd Consortium Meeting, 30-31 March 2017
After a hectic winter with many great scientific results and intense collaboration between the partners it was time for everyone to meet again for the third consortium meeting to recapitulate on the progress since the last meeting and to prepare for the upcoming review in June.
The meeting was held at the IBM Research – Zurich campus in Rüschlikon, Zurich, Switzerland, in the setting of a wonderfully sunny Swiss spring. During two days the consortium intensely discussed topics ranging from hybrid integrated RF circuits, material co-integration to BEOL design rules. Special attention was also given to the upcoming Industrial Roadshow which was to begin with a visit to ST Microelectronics. The mood was high and discussions lively, and continued during the breaks and lunch in the campus cafeteria.
At the end of a long day the consortium collectively went by bus into Zurich city to enjoy a fondue onboard a ship, cruising Lake Zurich as the sun was setting behind the still snow-clad alps.
The next day the meeting activities were resumed and the remaining work packages and General Assembly were dealt with in due order. Towards the end of the meeting, Professor Adrian Ionescu from EPFL, and also coordinator of the FP7 project E2Switch was invited to present the results and outcome of their project. This was very well received and an inspiration to all of us.
After the official meeting was over many attendees stayed on for a focused “Work package 4” workshop. In the evening we took our farewells and departed for home, until next time.